Martensitic ternary FeCrMn thin films sputtered from austenitic AISI 202 stainless steel target: Phase transition and corresponding magnetic properties under the influence of deposition rate

Abstract

The nanostructured materials exhibit quite different properties from their bulk counterparts. Therefore, in this work, phase transition from a commercial austenitic AISI 202 (Bulk FeCrMn) stainless steel to martensitic ternary FeCrMn thin films under variation of deposition rate were studied. The films were easily sputtered onto a flexible amorphous polymer substrate from the target by a DC magnetron. X-ray diffraction analysis showed that austenitic phase of the target converted into a mixture of martensitic and a very weak of austenitic phase of the films at the deposition rates of 0.04 and 0.06 nm/s. With a further increase of the deposition rate, martensitic phase in the films increased, and at the highest deposition rate, the film with 100 % martensite phase was obtained. According to magnetic analysis, austenitic target consists of paramagnetic and ferromagnetic components as oppose to the paramagnetic phase stated in the literature. The films obtained by sputtering of austenitic target have ferromagnetic character with an increasing saturation magnetization, M-S as the deposition rate increases. The increase of the M-S from 117 to 346 emu.cm(-3) may be explained by the increase of the % martensite that may increase the ferromagnetic character. Also, the increase of the coercivity of the films from 31 to 196 Oe may have come from the increase of % martensite and the increase of grain sizes with increasing deposition rates which may induce the stress in the films. It is seen that the nanostructured ternary FeCrMn thin films exhibit quite different phase and corresponding magnetic properties from their bulk counterpart. With sputtering, martensitic phase transition of ternary FeCrMn thin films can be controlled by varying deposition rates. It presents a potential usage for data storage and micro electric-electronic devices on flexible substrates.