EMI Reduction in Multilayer PCBs Using Planar Interdigital Slot Structures on the Reference Planes

dc.contributor.authorBaghel, Lalit Kumar
dc.contributor.authorSis, Seyit Ahmet
dc.contributor.authorUstuner, Fatih
dc.contributor.authorKumar, Suman
dc.date.accessioned2025-07-03T21:25:01Z
dc.date.issued2022
dc.departmentBalıkesir Üniversitesi
dc.description9th International Symposium on Microwave Antenna Propagation and ElectroMagnetic Compatibility Technologies -- AUG 26-29, 2022 -- Chengdu, PEOPLES R CHINA
dc.description.abstractIn mixed-signal circuits, the return currents of sensitive analog and noisy digital signals must be carefully isolated in order to protect the integrity of the analog signals. To address this issue, a common approach is to utilize slots on the reference plane between digital and analog circuits. However, the slots so created cause the discontinuity in the return current path for a signal passing over these slots which causes unintentional radiation and results in unwanted electromagnetic interference (EMI). In this regard, we propose the planar interdigital slot structures for use in reference planes of multilayer PCBs in order to provide a low impedance path for return current. The interdigital structure alleviates the return current path discontinuity and hence reduces the unintentional radiation. In addition to this, a relationship between radiated emission and transmission response is obtained, allowing the designer to tune the slot parameters to minimize radiation at the signal frequency. PCBs with different size planar interdigital slot structures are simulated in Ansys HFSS and is found that the longer digit length corresponds to better EMI reduction, especially at higher frequencies.
dc.description.sponsorshipUniversity Of Electronic Science & Technology Of China,Beijing Jiaotong University
dc.identifier.doi10.1109/MAPE53743.2022.9935171
dc.identifier.endpage356
dc.identifier.isbn978-1-6654-2775-3
dc.identifier.scopus2-s2.0-85142348566
dc.identifier.scopusqualityN/A
dc.identifier.startpage352
dc.identifier.urihttps://doi.org/10.1109/MAPE53743.2022.9935171
dc.identifier.urihttps://hdl.handle.net/20.500.12462/21307
dc.identifier.wosWOS:001449146700073
dc.identifier.wosqualityN/A
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoen
dc.publisherIeee
dc.relation.ispartof2022 Ieee 9th International Symposium on Microwave, Antenna, Propagation and Emc Technologies For Wireless Communications, Mape
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanı
dc.rightsinfo:eu-repo/semantics/closedAccess
dc.snmzKA_WOS_20250703
dc.subjectInternet of things (IoT)
dc.subjectelectromagnetic interference (EMI)
dc.subjectelectromagnetic compatibility (EMC)
dc.subjectprinted circuit board (PCB)
dc.subjectmixed-signal design
dc.subjectreturn current discontinuity
dc.titleEMI Reduction in Multilayer PCBs Using Planar Interdigital Slot Structures on the Reference Planes
dc.typeConference Object

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