Temperature profiles and thermal stresses due to heat conduction under fading memory effect

dc.authorid0000-0003-3662-0474en_US
dc.contributor.authorAvcı, Derya
dc.date.accessioned2022-03-03T11:23:42Z
dc.date.available2022-03-03T11:23:42Z
dc.date.issued2021en_US
dc.departmentFakülteler, Fen-Edebiyat Fakültesi, Matematik Bölümüen_US
dc.description.abstractExamining the thermal stresses in thermally loaded materials used in the construction of technological devices is a fundamental problem to determine how functionally durable they are. Therefore, it is noteworthy to analyze heat conduction models under prescribed initial and/or boundary temperatures from different perspectives. From this necessity, present work aims to achieve the temperatures and thermal stresses resulting from a fractional heat conduction model based on the Cattaneo's constitutive law equipped with a time-dependent exponential kernel. For a limiting cylindrical material, the effect of the surface temperature on the heating process is tried to be revealed. It is considered that heat conduction occurs axially symmetrically under two different boundary conditions. The Laplace and Hankel integral transform techniques are utilized to obtain analytical solutions to temperature distributions. Using the temperature functions and applying the constitutive relations of uncoupled thermoelasticity theory give the thermal stress components. The dependency of the temperatures and stresses on the fractional parameter, namely on the fading memory effect, is interpreted from the graphics obtained with MATLAB software. Simulation results show that the change in temperature and the change in associated thermal stresses for the heat conduction with fading memory are significantly dependent on the boundary temperatures. Therefore, the surface temperature of a material whose heat transfer is described with the model discussed here is quite decisive for its use in technological devices. This is the first study to examine the thermoelastic properties of the heat conduction model with regular fading memory in a bounded curvilinear region.en_US
dc.description.sponsorshipBalikesir University BAP 2018/055en_US
dc.identifier.doi10.1140/epjp/s13360-021-01319-w
dc.identifier.endpage15en_US
dc.identifier.issn2190-5444
dc.identifier.issue4en_US
dc.identifier.scopus2-s2.0-85103856497
dc.identifier.scopusqualityQ1
dc.identifier.startpage1en_US
dc.identifier.urihttps://doi.org/10.1140/epjp/s13360-021-01319-w
dc.identifier.urihttps://hdl.handle.net/20.500.12462/12068
dc.identifier.volume136en_US
dc.identifier.wosWOS:000636745100004
dc.identifier.wosqualityQ2
dc.indekslendigikaynakWeb of Science
dc.indekslendigikaynakScopus
dc.language.isoenen_US
dc.publisherSpringer Heidelbergen_US
dc.relation.ispartofEuropean Physical Journal Plusen_US
dc.relation.publicationcategoryMakale - Uluslararası Hakemli Dergi - Kurum Öğretim Elemanıen_US
dc.rightsinfo:eu-repo/semantics/embargoedAccessen_US
dc.subjectFractional Derivativesen_US
dc.subjectFundamental-Solutionsen_US
dc.subjectCaputo-Fabrizioen_US
dc.subjectGeneral-Theoryen_US
dc.subjectEquationen_US
dc.subjectDiffusionen_US
dc.subjectModelen_US
dc.subjectCylinderen_US
dc.subjectOrderen_US
dc.subjectFielden_US
dc.titleTemperature profiles and thermal stresses due to heat conduction under fading memory effecten_US
dc.typeArticleen_US

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