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dc.contributor.authorHacıismailoğlu, Mürşide Şafak
dc.contributor.authorAlper, Mürsel
dc.contributor.authorKöçkar, Hakan
dc.date.accessioned2019-10-16T11:15:58Z
dc.date.available2019-10-16T11:15:58Z
dc.date.issued2010en_US
dc.identifier.issn1938-5862
dc.identifier.urihttps://doi.org/10.1149/1.3422502
dc.identifier.urihttps://hdl.handle.net/20.500.12462/7030
dc.descriptionKöçkar, Hakan (Balikesir Author)en_US
dc.description.abstractA series of CoNiCu/Cu multilayers was potentiostatically electrodeposited on strong (100) textured Cu substrates from the electrolytes with different Ni concentrations. The x-ray diffraction (XRD) data showed that all studied samples exhibited a face centred cubic (fcc) structure. According to scanning electron microscopy (SEM) images, the surface morphology of the films is affected by their Ni content. The chemical analysis by energy dispersive x-ray spectroscopy (EDX) demonstrates that as the Ni ion concentration in the electrolyte is increased, the Ni content of the film increases while the Co and Cu contents decrease. Magnetoresistance (MR) measurements were carried out at room temperature in the magnetic fields of +/- 12 kOe. The samples grown from the electrolytes with the Ni concentration of up to 0.3 M exhibited giant magnetoresistance (GMR). For the samples grown from 0.3 M Ni, anisotropic magnetoresistance (AMR) begins to appear. The GMR decreased with increasing Ni concentration and the AMR appeared. For the 2.0 M Ni concentration, MR converted from GMR to AMR. Furthermore, the magnetization measurements made by a vibrating sample magnetometer (VSM) showed that the antiferromagnetic coupling between ferromagnetic layers weakened with increasing the Ni concentrations.en_US
dc.description.sponsorshipBalikesir University Research - 2005/18 State Planning Organization (DPT) - 2005K120170en_US
dc.language.isoengen_US
dc.publisherElectrochemical Soc Incen_US
dc.relation.isversionof10.1149/1.3422502en_US
dc.rightsinfo:eu-repo/semantics/openAccessen_US
dc.titleDependence of magnetoresistance in electrodeposited CoNiCu/Cu multilayers on Ni compositionen_US
dc.typeconferenceObjecten_US
dc.relation.journalElectrodeposition of Nanoengineered Materials and Devices 3en_US
dc.contributor.departmentFen Edebiyat Fakültesien_US
dc.contributor.authorID0000-0002-4862-0490en_US
dc.contributor.authorID0000-0001-5648-3230en_US
dc.identifier.volume25en_US
dc.identifier.issue41en_US
dc.identifier.startpage87en_US
dc.identifier.endpage95en_US
dc.relation.tubitakinfo:eu-repo/grantAgreement/TUBITAK/TBAG-1771en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US


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