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dc.contributor.authorBaghel, Lalit Kumar
dc.contributor.authorKumar, Suman
dc.contributor.authorSis, Seyit Ahmet
dc.date.accessioned2024-09-30T07:05:42Z
dc.date.available2024-09-30T07:05:42Z
dc.date.issued2023en_US
dc.identifier.isbn979-835034213-0
dc.identifier.urihttps://doi.org/10.1109/EMCTurkiye59424.2023.10287509
dc.identifier.urihttps://hdl.handle.net/20.500.12462/15234
dc.descriptionSis, Seyit Ahmet (Balikesir Author)en_US
dc.description.abstractThe proximity of microstrip lines in compact and dense designs leads to unwanted electromagnetic coupling, resulting in crosstalk that needs to be minimized. Various methods have been explored in the literature, including via fencing, guard trace, guard trace with via, serpentine guard trace, serpentine guard trace with vias, and serpentine microstrip lines. However, these approaches often necessitate additional spacing between the microstrip lines, difficult to fabricate, and offer limited crosstalk reduction. Hence, we propose a planar interdigital split consisting of conductive strips, arranged in a fashion similar to interdigital capacitor, and are incorporated within the space available on reference plane between the coupled microstrip lines. That is, no additional space between the lines is required for crosstalk reduction. Electromagnetic simulations are conducted using a 75x45mm RO4003 Rogers PCB within the frequency range of 1-8GHz. The results shows a significant improvement of 19dB compared to utilizing a solid ground on the reference plane. Moreover, the efficacy of the proposed interdigital split approach is reinforced by meticulous parametric analyses. These analyses can assist designers in fine-tuning the interdigital split parameters to achieve crosstalk minimization at specific frequencies.en_US
dc.language.isoengen_US
dc.publisherInstitute of Electrical and Electronics Engineers Inc.en_US
dc.relation.isversionof10.1109/EMCTurkiye59424.2023.10287509en_US
dc.rightsinfo:eu-repo/semantics/embargoedAccessen_US
dc.subjectCoupled Microstrip Linesen_US
dc.subjectCrosstalken_US
dc.subjectDefected Ground Structureen_US
dc.subjectElectromagnetic Couplingen_US
dc.subjectFar End Crosstalken_US
dc.titleCrosstalk reduction in coupled microstrip lines using ınterdigital split on reference planeen_US
dc.typeconferenceObjecten_US
dc.relation.journalIEEE International Symposium on Electromagnetic Compatibilityen_US
dc.contributor.departmentMühendislik Fakültesien_US
dc.identifier.volume7th International Electromagnetic Compatibility Conferenceen_US
dc.identifier.startpage1en_US
dc.identifier.endpage2en_US
dc.relation.publicationcategoryKonferans Öğesi - Uluslararası - Kurum Öğretim Elemanıen_US


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